Xigmatek Carbonado – new cooling soon in stores

February 16th 2010 | Posted by admin

Xigmatek is preparing a new cooling system CPU model Carbonado. The construction is based on technology HDT (heatpipe direct touch), consisting of poprowadzeniu Heat to direct contact with the surface of the processor. These quantities of heat in four have a diameter of 8mm. Combined them with painted black aluminum Finns. The entire heatsink weighs 660 grams and measuring 120 x 60 x 159 mm. The system includes a backlit LED fan with a diameter of 120 mm with neutralizing vibration mounting system, working with speeds from 1000 to 2200 RPM. Cooling system is compatible with the bases LGA-1366 LGA-1156, LGA-775 and AMD AM3/AM2 +. In addition, AMD platforms attached toolless mounting kits. The product will ship to stores in the coming weeks.

Professional Chicago Computer Repair and Chicago Laptop Repair Services

Related Posts

EPIA-P820 and AMOS-3001 – VIA puts the micro

VIA motherboard presented in the Pico-ITX board and is compatible with its cover. EPIA-P820 is equipped with the Nano U2500 processor 1.2 GHz embedded in a VX855 chipset. Cooperates with them, 2GB DDR2, Chrome9 integrated graphics, 5.1-channel VIA Vinyl Music 5.1, one port SATA connector 44-pin IDE and Gigabit Ethernet port. Housing AMOS-3001 [...]

AMD Shanghai

November 13 is the Prime Minister reads the latest AMD Opteron processors. systems code named Shanghai to help rebuild the image of the producer by problems with the Barcelona agreements. Opterony whose appointment has been taken from the Spanish capital of Catalonia, came up for sale in April this year. Despite the fact that their announcement [...]

Core i7 for sell

A few hundred fans of personal computers first appeared in a Saturday night in the Akihabara district of Technology in Tokyo. The reason for this move was Intel's event, organized on the occasion of the official start of sales of chips Core i7. Core i7 on sale Processor code named Nehal is the successor of current systems manufactured Intel [...]

USB 3.0 on Market

During the conference SuperSpeed USB Developers Conference, held on 17 November 2008 in the California city of San Jose, announced the completion of work on the USB specification 3.0. A new standard will allow the popular ten times faster data transfer than in the case of USB 2.0. In connection with the preparation work of the USB 3.0 [...]

Leave a Reply:

Name (required):
Mail (will not be published) (required):
Website:
Comment (required):
XHTML: You can use these tags: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>
Copyright © 2009 RoomDirectory, Best Computer Information Portal.
The Best Music and best Fight Video site.
Powered by Computer repair.  Brought to you by Casinos. computing , local news